The application relates to the technical field of organic
silicon materials, in particular to a high-temperature-resistant
coupling agent and application of the high-temperature-resistant
coupling agent in a
polyphenyl ether base material circuit board, wherein the high-temperature-resistant
coupling agent has a structure shown in formula I. The high-temperature-resistant coupling agent is prepared by
coupling reaction of an o-aminophenol compound and p-phenyloxy
iodobenzene to obtain an intermediate, and then reacting the intermediate with
chlorosilane in the presence of alkali. The high-temperature-resistant coupling agent contains an aromatic ring structure, a
siloxane group and a polar adaptive site at the same time, has high matching degree with
polyphenyl ether resin, benzoxazine resin, inorganic fillers and
metal foils, can significantly improve the
interface bonding force between
copper foils and
polyphenyl ether base materials, is synthesized by a two-
step method, has mild
reaction conditions, simple post-treatment, stable yield and less waste, and is suitable for large-scale industrial production.