The invention provides a
system for
polishing one or more
layers of a multi-layer substrate that includes a first
metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one
oxidizing agent, (iii) at least one
polishing additive that increases the rate at which the
system polishes at least one layer of the substrate, wherein the
polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols, thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, hydroxylates, carbonylates, carboxylates, and acids thereof, and mixtures thereof, (iv) at least one stopping compound, and (v) a polishing pad and / or an
abrasive. The invention also provides a method of polishing a substrate comprising contacting a surface of a substrate with the
system and polishing at least a portion of the substrate therewith. Moreover, the invention provides a method for polishing one or more
layers of a multi-layer substrate that includes a first
metal layer and a second layer comprising (a) contacting the first
metal layer with the system, and (b) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.