The invention belongs to a
gold plating solution, and particularly relates to a composite additive for a
semiconductor gold plating solution and application of the composite additive. The tellurite derivative comprises tellurite and substituted
benzaldehyde, wherein the substituted
benzaldehyde is shown as a general formula I, wherein R is selected from
sulfonyl or a derivative thereof. According to the technical scheme provided by the invention, through synergistic compounding of tellurite and substituted
benzaldehyde, the grain refinement degree and
grain orientation of the plating layer are remarkably improved, so that the surface of the plating layer is flat and bright, and the
gold plating layer with high compactness and
high conductivity is obtained. And the gold plating solution can meet the defect-free thickness requirement of 0.05-40 [mu] m. Besides, the
hardness of the plating layer before annealing is 60-100 HV, the
electroplating liquid can operate in a wide
process window (the
current density is 0.5-5 A / dm, and the temperature is 50-70 DEG C), and various application requirements of
semiconductor gold wiring, gold bumps, RDL gold
layers and the like can be met.