3results about How to "Lower the build temperature" patented technology

The invention belongs to the technical field of semiconductors, and discloses a composite coating for a semiconductor device and a preparation method thereof.The preparation method comprises the following preparation steps that organic resin and a carburant are added into an alcohol solvent to be evenly mixed, and a resin solution is obtained; the method comprises the following steps: adding a tantalum source and a phase forming accelerant into an alcohol solvent, stirring and mixing to obtain a tantalum solution; the surface of the base body is coated with a resin solution and a tantalum solution, heating curing, carbonization and cooling are carried out, a composite coating containing glassy carbon and tantalum carbide is obtained, and the composite coating is of a single-layer structure or a double-layer structure; the single-layer structure is a composite single-layer coating containing glassy carbon and tantalum carbide; the double-layer structure is a double-layer coating structure comprising a glassy carbon layer and a glassy carbon and tantalum carbide composite layer from bottom to top from one side of the surface of the base body. The density of the composite coating prepared by the method can be effectively improved, so that the corrosion resistance of the composite coating in a plasma environment is improved.

This invention belongs to the field of copper composite material preparation technology, specifically relating to a method for preparing single-walled carbon nanotube-copper composite materials. Single-walled carbon nanotubes are prepared using a flotation catalytic method, followed by acid washing and high-temperature repair purification. Subsequently, the single-walled carbon nanotubes are subjected to mixed acid gradient oxidation, and cobalt nanoparticles are chemically deposited onto their surface. Then, an amorphous titanium dioxide coating is composited onto the modified single-walled carbon nanotubes using a sol-gel method. The composite powder is added to molten copper and mixed uniformly under ultrasonic and magnetic field-assisted stirring. Finally, the mixture is rapidly solidified and hot-drawn into copper rods using a hot-casting method under continuous magnetic field assistance to obtain the single-walled carbon nanotube-copper composite material. This method improves the dispersion and interfacial bonding strength of single-walled carbon nanotubes in the copper matrix and enables the single-walled carbon nanotubes to oriented within the copper matrix. The method is simple, and the prepared composite material exhibits excellent electrical, thermal, and mechanical properties.

A radioactive nuclide 137 A rapid remediation device and method for Cs-contaminated soil includes an inlet for adding an activator and raw materials, a power supply, a microwave device, an auxiliary extrusion rod, a pressure plate containing a spray head, and a solid pressure plate. The solid pressure plate is located above the pressure plate containing the spray head, and the power supply and microwave device are positioned above the solid pressure plate. A spray head is provided on the pressure plate containing the spray head, and the auxiliary extrusion rod passes through the solid pressure plate and enters the spray head to extrude it. The spray head contains the activator and raw materials, and the auxiliary extrusion rod pushes the activator and raw materials into the soil. This application's solution combines microwave and solidification technologies to achieve remediation of soil containing radioactive nuclides. 137 Advantages of Cs in soil remediation.