The invention relates to a
processing method of nanometer-sized and micron-sized holes, which comprises the following steps: (1) a base material is cleaned, and
dirt on the surface is removed; (2)
photoresist is spin-coated, and after
exposure and development, a substrate is formed; (3) micro-nano
composite structure metal particles are deposited on the surface of the substrate; and with a
magnetic core as a center, the surface of the micro-nano
composite structure metal particle is plated with a
metal nanoparticle plating composed of a plurality of nano-gold, -silver or -
aluminium particles;(4) the
photoresist is removed with only a micro-nano
composite structure metal particle dot array left; (5)
laser is adopted to irradiate the substrate while a uniform strong
magnetic field is applied, so that processed holes are formed by
processing; (6) after nanometer-sized holes or micron-sized holes with a target hole
diameter, shape and depth are achieved,
laser irradiation is stopped and the uniform
magnetic field is removed, and thereby a finished product is obtained. The
processing method proposed by the invention can process blind holes or through holes with a hole
diameter being 100nm or more and any nanometer-sized shape, is
environmentally friendly, and is easy to operate, and the processed hole
diameter, shape and depth can all achieve a controllable effect.