The disclosure provides a
chip self-destruction
system, a method and a
chip, which are applied to the technical field of semiconductors, and the
system comprises: a soluble
conductive polymer film connected in series to a power supply path of a functional circuit; a microcapsule array arranged opposite to the film and storing a
corrosion agent inside; and a
control unit comprising a plurality of intrusion detection sensors, which, when the detection result meets a trigger condition, destroy the microcapsule array to release the
corrosion agent, break the film, and
cut off the power supply path. In view of the problems of the prior art, such as dependence on a battery, explosives, process incompatibility, large
trigger delay, high false
trigger rate and the like, the technical scheme of the present application does not require an external power supply, realizes zero
standby power consumption, is explosion-free and
pollution-free, is integrated with a back-end process by using the microcapsule array, is compatible with standard
CMOS manufacturing, is quickly triggered by
cutting off, can effectively prevent attacks by
laser probes and the like, can greatly reduce the false
trigger rate, and improves the self-destruction reliability.