The invention discloses a
sapphire mobile phone panel
processing method. The process consists of material preparation,
cutting, chamfering, rough
grinding, annealing, DMP, CMP (chemical mechanical
polishing), cleaning,
coating,
screen printing and finished
product inspection, wherein in the step 1 of
cutting, a
crystal block is sliced to facilitate follow-up
processing; in the step 2 of chamfering, the
wafer edge is trimmed into an arc shape to improve the
mechanical strength of the sheet edge and avoid
stress concentration and consequent defect; in the step 3 of rough
grinding, a
wafer cutting damage layer caused by
slicing is removed, and the flatness of the
wafer is improved; in the step 4 of annealing, the
stress concentration and large BOW caused by mechanical
processing are improved; in the step 5 of DMP, the damage layer caused by rough
grinding is improved, and the
surface roughness of the wafer is reduced; in the step 6 of CMP, the wafer roughness is improved so that the surface reaches the nanoscale precision; in the step 7 of
coating, the wafer is subjected to anti-
fingerprint coating treatment; and in the step 8 of
screen printing, the single side of the wafer is subjected to
screen printing treatment to enhance light absorption. By adopting the method, a
sapphire mobile phone panel without damage layer on surface and with nanoscale roughness can be obtained; moreover, the preparation period is greatly shortened, the production cost is saved, and the labor productivity is improved.