The invention discloses a preparation method of a multilayer 
ceramic circuit board. The multilayer 
ceramic circuit board is formed by stacking and bonding a plurality of electroplated 
ceramic substrates (DPC). The method comprises the following steps: firstly, preparing a DPC 
ceramic substrate containing a surface circuit layer and vertical 
interconnection metal columns through a pattern 
electroplating process; then preparing a 
metal solder on the circuit layer of the DPC 
ceramic substrate, stacking and aligning a plurality of DPC ceramic substrates, and then bonding to realize mechanical stable connection and electric 
interconnection between the DPC ceramic substrates; and finally, filling high-temperature-resistant insulating glue between the DPC substrates, and curing to obtain the multi-layer ceramic circuit board. By utilizing the characteristics of good heat conduction / 
heat resistance, high pattern precision, vertical 
interconnection and the like of the DPC ceramic substrates, mechanical connection and electric interconnection between the DPC substrates are realized through 
metal bonding, the multilayer ceramic circuit board with high reliability and high precision is prepared, and the requirements of 
miniaturization and integrated packaging of power devices are met.