Provided is a method for measuring
copper content in
tin-silver-
copper solder through
iodometry. The method comprises the following steps: a
copper standard solution is prepared and the
titer of the copper
standard solution is measured. A sample to be measured is weighed and added into an
Erlenmeyer flask. Concentrated
sulfuric acid is added and the mixture is heated for
dissolution. The above solution is cooled to the
room temperature,
perchloric acid is added, after the sample is dissolved fully, heating is carried out until white
smoke is generated, concentrated
hydrochloric acid is dropwise added into the above solution in batches to remove the
tin element in the solution, and the solution is subjected to concentration. The
Erlenmeyer flask is taken down and cooled to the
room temperature, deionized water is added, the constant volume is 100mL and the above solution is shaken up. Then an
ammonium hydroxide solution is added and copper
ammonia complex ions are formed. Then
ammonium bifluoride is added into the solution and stirred until the blue color disappears. The above solution is cooled to the
room temperature by utilization of running water. The solution is placed for half a minute, then
potassium iodide is added, and immediately the solution is subjected to
titration by a
sodium hyposulfite
standard solution until a shallow yellow color appears. Then a
potassium thiocyanate solution and a
starch solution are added, and the solution is subjected to
titration by the
sodium hyposulfite standard solution until a blue color disappears. The volume of the consumed
sodium hyposulfite solution is recorded, and the content of copper in the sample is calculated.