The invention relates to a preparation process of a
chip tray, which comprises the following steps: S1, proportioning the raw materials of the
chip tray in parts by weight: 35-60 parts of
polystyrene, 5-25 parts of PPO resin, 5-10 parts of PA resin, 20-30 parts of modified reinforced fibers, 6-8 parts of a
toughening agent, 0.1-0.5 part of an
antistatic agent, 5-8 parts of a filling agent, 6-10 parts of a compatilizer, 0.5-1 part of a dispersing agent, 5-7 parts of
pigment master batch and 4-9 parts of modified glass beads; s2, mixing the raw materials in the step S1, blending, melting and extruding, and cooling to obtain
raw material master batch; and S3, preparing a
sheet material from the
raw material master batch obtained in the S2, heating the
sheet material to soften the
sheet material, and then sequentially carrying out plastic uptake molding and demolding
cutting to obtain the
chip tray. The chip tray plastic uptake part has excellent
wear resistance and
heat resistance, so that the obtained chip tray plastic uptake part can ensure that the chip is not easy to damage in the transportation process in the application process.