The invention belongs to the technical field of
printed circuit board manufacturing, and particularly relates to a high-insulativity blind via hole PCB and a preparation method thereof. In preparation of the substrate, an inner
chip layer, an
epoxy resin glass cloth substrate and a
copper foil are subjected to primary lamination to prepare a PCB
daughter board, then drilling and
copper plating are performed to prepare a
blind hole, finally, secondary lamination is performed to prepare a PCB mainboard, hole sealing and curing are performed, a mark is subjected to silk-
screen printing, detection and packaging are performed to prepare the high-insulativity blind via hole PCB, and the
daughter boards are fully bonded through secondary lamination, so that the high-insulativity blind via hole PCB is obtained. 2-butyl long-chain
alkyl groups are introduced into the insulating
epoxy resin to improve
toughness and
impact resistance, and
norbornene rigid groups are introduced to enable the insulating
epoxy resin to effectively absorb
internal stress; the preparation method comprises the following steps: preparing xerogel from tetrabutyl
titanate and
barium acetate through gelation,
grinding and calcining to prepare insulating
ceramic powder, and introducing an epoxy group through a kH-560 modified surface, so that the
dispersity of an insulating medium filler in epoxy resin is improved, gradient heating curing is performed, and the insulating property of the high-insulating blind via hole PCB is improved.