The invention discloses a
copper block
cleaning agent for a
semiconductor packaging product and a preparation method, and belongs to the field of
semiconductor packaging, the
copper block
cleaning agent comprises microcapsules and a double-layer carrier, the microcapsules are uniformly distributed between the double-layer carrier, and the carrier is a modified
fiber felt; a core material of the microcapsule comprises the following components in parts by weight: a volatile
solvent, water, a low molecule-high molecule compound, didecyl
adipate,
sodium hyaluronate and nano
titanium dioxide; the
capsule wall of the microcapsule comprises the following components:
chitosan, Arabic gum, fish
gelatin and a cross-linking agent, the
mass ratio of the
chitosan to the Arabic gum to the fish
gelatin is 1: 2: (2-3), and the dosage of the cross-linking agent is 0.1-0.15% of the total amount of the
chitosan, the Arabic gum and the fish
gelatin. The problems that existing cleaning objects such as
alcohol cotton pieces can be rapidly dried in the
natural environment and lose the cleaning capacity in a short time are solved.