The invention relates to the technical field of brightener
processing, in particular to an acid
copper plating brightener, an acid
copper plating
electroplating solution and an
electroplating technology of the acid
copper plating brightener. The
cleaning agent is prepared from the following raw materials by concentration: 50-100 g / L of octadecylamine
polyoxyethylene ether, 10-20 g / L of
thiamine hydrochloride, 5-30 g / L of polydiaminourea, 20-40 g / L of
aspirin sodium and 80-120 g / L of a surfactant. According to the brightening agent, through the synergistic effect of all the components, the problems that a traditional brightening agent is prone to scorching,
fogging and coarse
crystallization under the
high current density are effectively solved, the contradiction between
deep hole filling and plate
surface brightness is balanced, the dog-bone-shaped distribution and cavity defects in high-thickness-
diameter-ratio through hole
electroplating are overcome, and overplating and stripes in a low-current area are avoided. The obtained
copper plating layer is fine in
crystallization, bright and flat, the interlayer
interconnection reliability and the microscopic uniform plating capacity are remarkably improved, the method is matched with the VCP vertical continuous electroplating technology, and the light, thin and high-frequency manufacturing requirements of high-density and fine circuit PCBs are met.