The invention relates to the technical field of
copper foil production, in particular to a production process of
copper foil for
chip packaging. The production process comprises the steps that an
electrolyte is prepared, a functional additive and
sodium chloride are added into the
electrolyte, and the functional additive is synthesized through a two-step reaction of 3, 3 '-dithiodipropionic acid,
thionyl chloride and
cysteamine hydrochloride; carrying out electrolytic deposition under specific
process conditions; and finally, washing,
drying, slitting and rolling to obtain a
copper foil finished product. The
copper foil produced by the invention not only has excellent
oxidation resistance and
heat resistance, but also has the advantages of low roughness, high peel strength and the like, and the service life of the prepared
copper foil product is prolonged to a certain extent while the quality of the prepared
copper foil product is effectively ensured. In addition, according to the production process provided by the invention, a roughening
treatment procedure and an anti-oxidation layer
coating procedure which are heavy in
pollution and high in
energy consumption in a traditional process are thoroughly omitted, and the production process is more environment-friendly and more economical.