The invention provides an
epoxy resin curing agent containing MOFs as well as a preparation method and application thereof, and the preparation method comprises the following steps: S1, dissolving an organic ligand in an N, N-
dimethylformamide (DMF) solution, and dropwise adding a
sodium hydroxide aqueous solution into the organic ligand solution to obtain disodium salt; s2, dissolving the disodium salt precipitate obtained in the step (1) in
distilled water; slowly dropwise adding 10mL of deionized water into
manganese chloride, stirring and dissolving, adding a disodium salt
aqueous solution, mixing, and carrying out
vacuum drying to obtain a
metal organic framework material Mn-NPA; s3, heating the Mn-NPA, and carrying out
vacuum drying and activation on the Mn-NPA; s4, Mn-NPA and an
imidazole compound are mixed for a load reaction; and S5, filtering and
drying the reacted mixture to obtain the
epoxy resin curing agent containing MOFs. According to the
epoxy resin curing agent containing MOFs, an epoxy
resin coating can be prepared into a
single component, and the epoxy resin curing agent can be used once a cover is opened and is convenient to use and easy to construct.