The invention discloses a reinforcing and
toughening method of a microporous
copper foil, and belongs to the technical field of
copper foil reinforcing and
toughening, the method comprises the following steps: S1, fixing the
copper foil on a tension roller, controlling the roller to operate to drive the
copper foil to enter a
sulfuric acid solution for
pickling, and removing an
oxide layer on the surface of the
copper foil; s2, an
electroplating solution is prepared, the
electroplating solution mainly comprises
sulfuric acid and
copper sulfate, the
sulfuric acid and the
copper sulfate are mixed together according to a certain proportion, and the
electroplating solution is prepared through stirring; and S3,
through transmission of a tension roller, the
copper foil passes through the electroplating liquid, electrochemical deposition is conducted, the copper foil serves as a
cathode, the DSA
coating titanium plate serves as an
anode, and a layer of compact copper is deposited on the surface of the copper foil. In the invention, the copper reinforcing layer selectively performs
nucleation growth on the surface of the copper foil and is not deposited in the hole. The micro-defects caused by
etching or
laser perforation and the like around the hole are reinforced by the reinforcing layer, so that the
mechanical property is greatly improved, and the
ductility is improved by 40-50%. And the improvement of the
mechanical property ensures that the copper foil can be smoothly applied downstream.