A disclosed polishing fluid for stainless steel materials is characterized by being prepared from the following raw materials in parts by weight: 7-9 parts of aluminium oxide, 3-5 parts of magnesium oxide, 2-3 parts of manganese oxide, 1-2 parts of zinc sulfate, 2.5-3.5 parts of polyvinylpyrrolidone, 4-6 parts of ethylene dimethacrylate, 3.5-5 parts of disodium hydrogen phosphate, 1-2 parts of lithium bis(trifluoromethanesulphonyl)imide, 1-2 parts of methionine, 4-6 parts of tween 80, 5-7 parts of an auxiliary agent, and 300 parts of deionized water. The prepared mixed polishing fluid is safe, non-toxic, free of unpleasant smells, and reasonable in formula. Through the cooperation of the abrasive and the surfactant, preferential adsorption is realized, and a long-term easily-cleaned physical adsorption surface is formed. The polishing fluid belongs to an aqueous polishing fluid, is capable of substantially reducing temperature caused by friction during polishing, avoiding burn phenomenon on a material surface and giving play to good cooling effect. The polishing fluid is added and used when a stainless-steel material machine needs polishing.